HealthCare IT

White Paper: Particle Works

The development of nanoparticles (NPs) as drug carriers for specific action sites has gained significant attention in recent times. However, the synthesis of NPs for drug delivery is complex and challenging, and therefore requires consistent, low-cost, and efficient materials. Particle Works offers NP synthesis solutions that are underpinned by microfluidics and automation, enabling researchers to accelerate their nanomedicine development. The Automated Nanoparticle (ANP) System provides both automated process optimization and continuous manufacturing capabilities on a single platform. This system allows scientists to automatically optimize process parameters and generate test samples. Particle Works offers the ALiS System for screening low volumes of various formulations in a 96-well plate format, while the ANP System is used to optimize the size, shape and structure of NPs ahead of final production and commercialization. The ANP System can be used initially in ’protocol mode’, where the system can sequentially execute a table of automated and low volume experiments from a fixed pair of injected reagents. Using the Flow Control Centre (FCC) software, users can optimize the flow rate ratio (FRR), total flow rate (TFR), NP precursor volume, sample collection volume, and select optional in-line dilution. Once a desired set of experimental conditions has been identified, the user can then switch to ‘continuous mode’ to create liters of NPs for pre-clinical trials and extensive characterization. Unique in this dual capability, the ANP System bridges the gap between formulation screening and commercial scale manufacturing in a single system solution.

White Paper: Jumio

Biometrics and AI Build the Strongest ID Verification Tech Biometrics are commonplace. They protect our phones, log us into our virtual workspaces, secure our health records and verify our identity when we sign up for new services. Face, fingerprint, iris, voice and other modalities proliferate across our physical and digital lives, facilitating access, managing identity and keeping us safe from fraud. But it is crucial to understand that not all biometric technology is created equal. The fact is, there are smart biometrics and basic ones. Functionally, allbtrue biometrics, regardless of the modality, do what the name implies: measure unique physical or behavioral traits and compare them. Some consumer-grade biometric solutions keep it simple, measuring and comparing and matching the same way every time. On the other hand, smart biometrics, which are enhanced by artificial intelligence and machine learning, adapt with every use, getting stronger, faster and more scalable. The latter type is a foundational aspect of a broader trend that FindBiometrics calls “Intelligent ID” – a key technology for the future of our increasingly digital and mobile lives. Artificial intelligence is a heavy term in our culture, and it brings with it a great deal of baggage in the form of common misconceptions. When it comes to intelligent biometric identity, these misconceptions pool around face biometrics, identity proofing and continuous authentication, which taken together are the basic components of a trust chain. Fears about user privacy, distrust stemming from racial bias reports in surveillance systems, and the expectation that identity proofing must rely on a human element in the onboarding process are all common false precepts clouding the understanding of smart biometrics in ID verification and user authentication.

White Paper: Apm Communications

3D Stacked Technology Patented by apm Communication Inc. In the chip package structure for the prior art, the electronic components are mounted on the substrate. When a large number of electronic components are required to be mounted, a large mounting area is required, and therefore a large-area substrate is also required. Moreover, the area of the overall chip group structure is increased, which is disadvantageous for space utilization, and the overall manufacturing cost is also increased. Most of today's electronic products are required to be smaller and smaller, so the overall size of the circuit board must be reduced for weight, thickness and formfactor. In order to miniaturize the substrate size, an electronic chip module with a double-sided mounting component is achieved with the latest invention, comprising of: a carrier plate for mounting at least one first component above the carrier plate; on the substrate; at least one mounting slot having a recess under the carrier, the bottom surface of at least one slot for mounting at least one second component; wherein the mounting slot is on the bottom surface on the carrier. The opening is outward, wherein the bottom surface for at least one second component mounted in the mounting slot faces the outside of the carrier to form a non-buried structure. The carrier is a multi-layer carrier. A connecting member is disposed under the carrier plate without forming a mounting slot, and the carrier is fixed to the substrate via the connecting member. Wherein the mounting slot has at least one layer on the bottom of the multilayer carrier is hollowed out to form a recessed slot. At least one mounting slot is a plurality of mounting slots for mounting at least one second component. The upper surface of the carrier further includes at least one positioning slot, wherein the at least one first component is mounted in the positioning slot above the carrier board; wherein the positioning slot is a bottom surface on the carrier board. The opening is outwardly open, wherein a bottom surface of the at least one first component mounted in the positioning slot faces the outside of the carrier to form a non-buried structure. A package structure encapsulates the carrier board and the component with packaging material; the connector extends beyond the package structure such that the package structure can be mounted to the substrate or to other components. A plurality of blind via holes are formed on the carrier board for guiding the wires. The connecting member is a copper post, a solder ball, or a solder pad. The contacts of the first component and the second component are connected to the conductor assembly and extend through the blind via to the underside of the carrier to form a conductive path for signal or electrical transmission, and then connected to the substrate.