White Paper: apm communications
3D Stacked Technology Patented by apm Communication Inc.
In the chip package structure for the prior art, the electronic components are mounted on the substrate.
When a large number of electronic components are required to be mounted, a large mounting area is required, and therefore a large-area substrate is also required. Moreover, the area of the overall chip group structure is increased, which is disadvantageous for space utilization, and the overall manufacturing cost is also increased. Most of today's electronic products are required to be smaller and smaller, so the overall size of the circuit board must be reduced for weight, thickness and formfactor. In order to miniaturize the substrate size, an electronic chip module with a double-sided mounting component is achieved with the latest invention, comprising of: a carrier plate for mounting at least one first component above the carrier plate; on the substrate; at least one mounting slot having a recess under the carrier, the bottom surface of at least one slot for mounting at least one second component; wherein the mounting slot is on the bottom surface on the carrier. The opening is outward, wherein the bottom surface for at least one second component mounted in the mounting slot faces the outside of the carrier to form a non-buried structure.
The carrier is a multi-layer carrier. A connecting member is disposed under the carrier plate without forming a mounting slot, and the carrier is fixed to the substrate via the connecting member. Wherein the mounting slot has at least one layer on the bottom of the multilayer carrier is hollowed out to form a recessed slot. At least one mounting slot is a plurality of mounting slots for mounting at least one second component. The upper surface of the carrier further includes at least one positioning slot, wherein the at least one first component is mounted in the positioning slot above the carrier board; wherein the positioning slot is a bottom surface on the carrier board. The opening is outwardly open, wherein a bottom surface of the at least one first component mounted in the positioning slot faces the outside of the carrier to form a non-buried structure.
A package structure encapsulates the carrier board and the component with packaging material; the connector extends beyond the package structure such that the package structure can be mounted to the substrate or to other components. A plurality of blind via holes are formed on the carrier board for guiding the wires. The connecting member is a copper post, a solder ball, or a solder pad. The contacts of the first component and the second component are connected to the conductor assembly and extend through the blind via to the underside of the carrier to form a conductive path for signal or electrical transmission, and then connected to the substrate.